CSG-H1

Product Description
Chemical name: 2-Mercaptothiazoline
CAS Number: 96-53-7
Appearance: off-white to white crystals
M.W.: 119.21
pH Value: 10.0-12.0 (1% Aqueous Solution)
Active Ingredient Content (%): 98
Water Solubility: Slightly soluble in hot water, typically dissolved by boiling; readily soluble in alcoholic solutions.

Product Applications
In Acid Copper Plating Process:
1. As a primary brightener, it effectively enhances the brightness and leveling of the coating, with fast brightening speed, helping to achieve a mirror-bright copper layer.
2. In copper plating formulations, it is often used in combination with additives such as SPS/Sp to rapidly attain bright copper layers and significantly improves the throwing power and covering power of the plating solution.
3. Concentration control in the plating bath: If the concentration is too low, brightness and leveling are insufficient; if too high, defects such as dendritic bright streaks may occur.
Electroforming: H1 can also be applied in electroforming processes, enabling the deposition of copper layers exceeding 1 mm in thickness within 24 hours, while maintaining good brightness and leveling properties.
In Nickel Plating Process: Used mainly as an auxiliary brightener or leveler with other additives, it also serves as a stress reliever in nickel plating baths, reducing internal stress and preventing cracking.
In the Rubber Industry:
1. It can be used as an antioxidant for natural rubber and synthetic rubber.
2. It can serve as an intermediate for synthesizing other rubber auxiliaries, such as novel high-performance vulcanization accelerators.
As a Corrosion Inhibitor in Certain Metal Treatment Solutions: It forms a dense protective film on the metal surface, thereby blocking the attack of corrosive media (such as acids, water, oxygen, etc.).