CSG-110

Product Description
Chemical name: Thiazolinyl dithio propane sulfonate
CAS Number: 8106-00-1
Appearance: White to light yellow powder / Pale yellow liquid
Active Content: 98.0% (for solid) /50.0% (for aqueous solution)
Water Solubility (20°C): Freely soluble in water

Product Applications
Acid Copper Plating Additive：
1. Enhanced Throwing Power & Leveling: Effectively improves filling capability in micro-vias and complex patterns, ensuring uniform coating thickness across different current density regions and achieving a smoother surface.
2. Grain Refinement: Significantly refines the grain structure of the copper deposit, resulting in a denser coating with superior mechanical properties.
3. Microstructure Control: In high-precision applications, concentration adjustment enables controlled transition between equiaxed grains and columnar nanotwinned structures to meet specific performance requirements.
Key Application Areas:
1. High-End PCB Manufacturing: Especially suitable for high-density interconnect (HDI) boards and fine-line circuitry, serving as a critical additive to ensure product quality.
2. Integrated Circuits & Semiconductor Packaging: Used for filling fine patterns in high-density packaging structures, ensuring uniform and level filling results.
3. Decorative & Functional Plating: Applied in copper or copper alloy plating processes requiring high leveling and bright surface finish.